Design & Expertise

Our Workflow

Our Expertise

Optoelectronics Packaging

High-performance Optics and Electronics Integration and Packaging adopting the advanced mSAP PCB technology, die-bonding, wire-bonding and active alignment

High-speed Twinax

High-speed twinax engineering and processing technology enabling cost-effective 112G PAM4/224G PAM4 and future 448G PAM4 cabling

Advanced Engineering

Technical and engineering team to manage the most challenging signal integrity, power integrity, thermal integrity and optical designs

Cutting-edge Testing

In-house system testing & validation lab facilitated with 800G/1.6T/3.2T networking equipment and test fixtures to accommodate performance, interop, compatibility and reliability