Infraeo will be exhibiting at OFC 2026 at the Los Angeles Convention Center, March 17–19. We invite attendees to visit us at:
📍 Booth #5033 | West Hall
At this year’s show, we will highlight our next-generation 1.6T interconnect portfolio, including 1.6T OSFP LPO transceivers and 1.6T Active Electrical Cables (AEC) designed to support the rapidly growing bandwidth demands of AI clusters and hyperscale data centers.
In collaboration with Marvell, Infraeo will also demonstrate its 1.6T OSFP AEC powered by Marvell’s Alaska Leo DSP, running on the 1.6T Quantum 3400-RT switch, showcasing the role of next-generation copper interconnects in high-bandwidth AI infrastructure.
At the Infraeo booth, we will also showcase our 800G 9 m AEC, among the longest copper interconnect solutions in the industry, enabling longer-reach copper connectivity across multiple racks for large-scale AI systems.
Across the show floor, Infraeo’s interconnect solutions will also be demonstrated with ecosystem partners, including VIAVI and Intel, highlighting interoperability across test platforms and system environments.
If you are attending OFC, feel free to reach out to schedule a meeting with our team. We look forward to seeing you in Los Angeles.