Infraeo is proud to announce that several of our high-speed interconnect solutions will be recognized at the Lightwave Innovation Awards during OFC 2026. This recognition reflects our continued focus on building advanced optical and copper interconnects for AI clusters, hyperscale data centers, and next-generation high-performance computing environments.
As AI infrastructure grows more complex, system architects need interconnect solutions that deliver more bandwidth, longer reach, lower power consumption, and dependable signal integrity. Infraeo develops products that help solve these challenges across both optical and copper connectivity. The Lightwave Innovation Awards recognition highlights the impact of these technologies as the industry moves toward 800G and 1.6T deployments.
The following Infraeo solutions received recognition at OFC 2026:
1.6T 2×DR4/DR8 LPO Module (Silicon Photonics) | Rating: 4.0
Infraeo’s 1.6T 2×DR4/DR8 LPO module is a low-power optical solution built for high-bandwidth connectivity. It reduces power consumption and latency compared with traditional DSP-based optics, making it a strong fit for AI and hyperscale environments where efficiency matters.
9m 800G OSFP Active Electrical Cable | Rating: 4.0
Infraeo’s 9m 800G OSFP Active Electrical Cable is one of the longest copper interconnect solutions available today. Built with Marvell Technology DSP, it extends copper reach while preserving signal integrity. This allows stable multi-rack connectivity for next-generation AI systems and gives data center operators more flexibility in rack layout and system design.
5m 1.6T OSFP Active Electrical Cable | Rating: 3.5
Also built with Marvell Technology DSP, Infraeo’s 5m 1.6T OSFP Active Electrical Cable supports next-generation 200G-per-lane architectures. It helps enable the high-speed copper connectivity required for AI clusters, hyperscale infrastructure, and other demanding network environments.
We are honored to receive this industry recognition and grateful to the customers, partners, and engineering teams who continue to drive innovation in high-speed connectivity. Their collaboration helps us push performance further across both optical and copper interconnect technologies.
If you are attending OFC 2026 in Los Angeles, visit Infraeo at Booth #5033 in West Hall to learn more about our latest solutions. You can also explore our Active Electrical Cables, LPO transceivers, and other AI infrastructure connectivity products on our website.
For more information about OFC, visit the official OFC event site. You can also learn more about the Lightwave Innovation Awards through Lightwave Online.