Our story
Our team has spent years engineering high-speed interconnects across the electrical and optical layers of complex systems. We know the failure points: signal integrity at high data rates, power and thermal constraints, link margin, interoperability across silicon and architectures, and the gap between a design that delivers in the lab and one that works in production.
800G, 1.6T and beyond. Tighter power envelopes, higher port density, and rapidly evolving accelerator and switch architectures open up more choices — and more complexity. The interconnect has to work across the system, with the right combination of technologies for the architecture. And it has to be manufacturable at scale.
Infraeo was built for that challenge. We combine electrical and optical engineering, an open silicon ecosystem, system-level validation, and high-volume manufacturing to take proven interconnect solutions from design to deployment to production.












