What can Infraeo do with your team?

Design-in, manufacturing, and engineering support from one team — the same engineers on the same project, accountable for the same deployment.

01

We design it with you, not for a catalog.

From architecture sketch through design-in and qualification, our engineers work alongside yours — sizing reach, power, and cost for your cluster, not a generic reference design. We help make the tradeoffs, choose the right medium, and turn the architecture into a production-ready interconnect.

Two Infraeo engineers working through a signal trace together on screen
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02

The right build, when you actually need it.

When demand climbs, capacity shouldn't be the thing that slows you down. Our Texas-led, geo-diverse production takes qualified designs to large-scale manufacturing — giving you the capacity and flexibility to scale with your program. Real production capacity, at the scale your build demands.

Two high-speed automated assembly lines running on the Infraeo production floor, with operators at each
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03

An engineering team beside yours — through qualification, launch, and beyond.

From interoperability and bring-up to qualification and debugging, our engineers work at the system level — with the equipment and expertise to replicate customer problems in our labs, investigate what’s happening, and help get the deployment over the line.

The expertise behind the interconnect.

Infraeo brings engineering depth across the electrical, optical, packaging, and validation challenges behind modern AI infrastructure.

  • Optoelectronics packaging

    Engineering the physical and optical integration behind high-performance interconnects.

  • High-speed twinax

    High-speed electrical interconnect expertise for demanding AI infrastructure.

  • Advanced engineering

    Engineering across the factors that determine whether an interconnect performs in the real system.

    • Signal integrity
    • Power integrity
    • Thermal integrity
    • Optical design
  • Cutting-edge testing

    Testing and validation across 800G · 1.6T · 3.2T.

    • Performance
    • Interoperability
    • Compatibility
    • Reliability
Validation benches with boards under test on ESD mats, instrument racks behind and screens showing measurement results
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Talk to the engineers.

Bring the hard part of your design. We'll bring the architecture.