Build the fabric your training cluster demands.
Training clusters push reach, power, and density to the edge at once. The interconnect has to keep pace with the GPUs — across the rack, across the aisle, and across the fabric.
Infraeo engineers the right mix of copper and optics around your architecture, power budget, and deployment requirements.
Talk with EngineeringThe interconnect equation changes at scale.
As AI clusters grow, the links between GPUs, switches, and racks become an increasingly important part of the architecture.
Every connection brings a different set of tradeoffs:
- ReachHow far does the signal need to travel?
- PowerHow much of your infrastructure power budget should the fabric consume?
- DensityHow do you move more data without making the system harder to build, route, and service?
- InteroperabilityWill the interconnect work reliably across the hardware and silicon in the architecture?
The answer isn't always copper. It isn't always optics.
It's the right medium for every reach.
Copper where it wins. Optics where it counts.
We design across the full copper-to-optical spectrum — scale-up inside the rack, scale-out and scale-across the fabric.
Connect GPUs and components within the rack with the right balance of reach, power, density, and cost.
Connect racks and systems as distance increases and optical connectivity becomes part of the architecture.
Build connectivity across the broader fabric with the interoperability and reach the architecture requires.
The goal is simple: give every link what it needs — and nothing it doesn't.
We know what your cluster needs.
Our engineers work at the system level — not just at the component level. We bring a proven portfolio of interconnects to the design, understand how the pieces need to work together, and help identify the right fit for the architecture.
When a standard solution doesn't meet the requirement, our engineering team can develop and qualify a custom design.
Built for where training is going.
As fabrics move toward 1.6T and beyond, today's decisions determine how much of the architecture you can carry forward.
Infraeo helps you design for the current build while keeping the next generation in view.
1.6T today. 3.2T on the roadmap.
Relevant Infraeo technologies
- Active Electrical Cables (AEC)Retimer-based copper for extended reach while keeping copper's cost and power advantages.
- Active Copper Cables (ACC)Active signal conditioning for reach beyond passive copper, up to 1.6T-class.
- Direct Attach Cables (DAC)The simplest, lowest-power option for short intra-rack runs.
- Active Optical Cables (AOC)Longer reach and high-density routing when copper reaches its practical limit.
- Pluggable OpticsScalable optical links for long-reach, reconfigurable fabrics, including LPO.
Proof that reaches beyond the spec sheet.
9m 800G AEC
- World's first multi-mode LPOUnder 5W · Mass production.
- Complex low-latency copperEngineered and manufactured for inference at scale.
World-record reach.
Built for repeatability.
Don't design around the cable. Design around the cluster.
Bring your reach, power, density, and deployment requirements.
We'll bring the architecture.
Talk with Engineering