We're excited to announce that Infraeo will be exhibiting at DesignCon 2025, taking place January 28-30 at the Santa Clara Convention Center in California. Visit us at Booth #759 to experience a live demonstration of our cutting-edge 1.6T copper solutions, designed to power the future of high-speed connectivity for AI, data centers, and enterprise networking.
Our 1.6T copper solution demo will showcase our commitment to delivering low power consumption, minimal latency, and unmatched flexibility. With over 1 million units shipped this year and production expansion into Mexico and Vietnam planned for 2025, Infraeo is positioned to provide our customers with faster lead times and high-capacity manufacturing.
If you're attending DesignCon, we'd love to meet you! Schedule a meeting with our team to discuss how Infraeo can support your connectivity needs.
Rehan Khan, VP of Business Development & Sales Engineering: rkhan@infraeo.com
Bei Lin, Marketing and Sales Specialist: blin@infraeo.com
Join us at Booth #759 to see how Infraeo is shaping the future of connectivity and explore how we can help your projects succeed.