OFC 2026 · What you missedInfraeo showcased its latest solutions at OFC 2026, highlighting how our partner ecosystem validates solutions and demonstrates interoperability across the industry.
Building a Validated Ecosystem for High-Speed Connectivity
We're building an ecosystem of partners across chip makers, systems, and test platforms to validate interoperability. As the industry transitions to 1.6T speeds, seamless cross-platform functionality becomes critical.
Infraeo collaborated with Marvell, Semtech, Intel, Celestica, VIAVI Solutions, and Keysight Technologies.
Key focus areas: 1.6T and 800G production-ready solutions, real-world validation through partnerships, and industry recognition via awards.
1.6T & 800G Production Ready AECs and LPOs
At OFC26, we focused on what's next for AI infrastructure: production-ready 1.6T and 800G connectivity.
Being one of the few companies able to produce 1.6T interconnects, our 1.6T AECs are designed to support this next generation, offering a reliable, low-latency copper alternative to optics for short-reach connectivity.
At the same time, 1.6T & 800G LPO transceivers are gaining attention as a more power-efficient and cost-effective approach compared to traditional optics, while still maintaining the performance required for high-speed deployments.
We also demonstrated our ability to achieve extended reach with our 800G 9-meter AEC, among the first in the industry to reach 9 meters with copper, enabling more flexible system and rack-level designs where longer copper connections are critical.
Most importantly, these are not roadmap concepts. They are available today, ready to support real deployments with the capacity to scale.
Infraeo Products Validated and Showcased Across the Ecosystem
Building on our 1.6T and 800G production-ready AECs and LPO solutions, we focused on how these technologies perform beyond standalone testing, specifically how they integrate across real-world deployments.
Through collaboration with partners spanning chip makers, system vendors, and test platforms, we demonstrated reliable performance across the AI data center stack, proving seamless interoperability and readiness for deployment.
Keysight Technologies — Infraeo collaborated with Keysight to showcase our 800G 9-meter AEC in Keysight's FITS-8CH test equipment, demonstrating stable BER at E-8.
Marvell Technology — Infraeo's 1.6T & 800G AEC displayed at Marvell's booth. Powered by Marvell's Alaska Leo DSP, running on a 1.6T Quantum 3400-RT switch.
Celestica — Infraeo's 1.6T AEC at Celestica's booth, running live on Celestica DS6000 switch.
VIAVI Solutions — Infraeo's 1.6T AEC, 800G AEC, and 400G SR4 transceivers showcased at VIAVI's booth, all showing stable BER at E-8 and lower.
Intel — Infraeo's 800G LPO DR8 transceivers at Intel's booth, developed with Intel's silicon photonics technology.
Semtech — Infraeo's 1.6T ACC at Semtech's booth, developed in collaboration with Semtech's redriver technology.
Industry Recognition Validating the Direction of High-Speed Connectivity
Several of the solutions mentioned above were recognized at the Lightwave Innovation Awards, reflecting the leading position of Infraeo.
These awards highlight not just performance, but the growing importance of power efficiency, extended reach, and system-level interoperability, all critical for real-world deployment. It’s a strong signal that the technologies we’re focused on are aligned with what the market is actively demanding.
1.6T 2×DR4/DR8 LPO Silicon Photonics Module — Rating: 4.0
9-meter 800G OSFP Active Electrical Cable — Rating: 4.0
5-meter 1.6T OSFP Active Electrical Cable — Rating: 3.5
A Huge Thank You from Infraeo!
Thank you to everyone for the conversations, collaboration, and the opportunity to share our work at OFC 2026. Follow us on LinkedIn to track our upcoming developments.
